The COFA Series by AENON is a high-reliability adhesive portfolio for semiconductor packaging, covering flip-chip underfill, UV/dual-cure, and epoxy heat-cure across key process steps.
✔ Flip-Chip Underfill (CFA 4000F): Low moisture absorption (≤0.2%), Shore D 95 hardness, Tg 110–112°C, delivering reflow/thermal-shock reliability for BGA/CSP/PoP
✔ Dual-Cure (CFA 1000D): UV tack + thermal reinforcement enables shorter cycle times with enhanced impact/vibration durability (e.g., 3,000 mJ UV & 80°C/60 min)
✔ UV Cure (CFA 2000U): Transparent bonding & low-temperature processing for camera/optical sensor modules and wearable/display sealing, with balanced viscosity/rheology
✔ Heat Cure (CFA 3000H/5000S): Rubber-toughened structure for impact/vibration resistance; ≤80°C low-temp cure suitable for heat-sensitive parts
✔ Process Efficiency: Controlled viscosity & thixotropy (e.g., TI 1.0–1.8, 3.6–4.8) for stable dispensing, void suppression, and automation-ready flow
✔ Spec Examples
　· CFA 4100F/4200F/4300F (Underfill): 11,000–45,000 cps, 0.2% shrinkage, 72 h work life
　· CFA 1001D (Dual-cure): 30,000 cps, TI 4.8, Shore D 92, 48 h work life
　· CFA 3100H/3200H (Heat-cure): 16,000–20,000 cps, Shore D 80–82, 80°C/30 min cure
　· CFA 5001S/5002S (Die attach): Warpage control (cry/smile) with low-modulus option
✔ Applications: HBM/AI-HPC packages, mobile/automotive image sensors, package underfill/reinforcement, thin-component transparent bonding
✔ Performance & Cost: Low moisture/shrinkage and high Tg formulation for long-term reliability; localized raw-material sourcing for supply stability & cost advantage
✔ Customization: Tailored viscosity/filler/color (black/red/ivory/transparent) and curing profiles to fit customer processes
✔ Support: Samples, datasheets, and application support for dispensing nozzles and curing optimization