Grooving – The LMC3200G performs laser scribing to pre-remove the patterned layer composed of Low-k material and metal wiring on the wafer saw lane. This process minimizes chipping issues during the subsequent blade dicing process, thereby improving chip production yield.

Dicing – The LMC3200D is a laser cutting system primarily designed for thin wafers with a thickness of less than 200 µm. Unlike traditional blade dicing, which requires frequent replacement of consumable blades, laser processing has a significantly longer service life with minimal component replacement, making it highly cost-effective (COO). In terms of quality, the non-contact laser process drastically reduces chipping and enables high-speed processing.