Product Description
ORO's conductive powder is a high-performance plating powder optimized for semiconductor test sockets, especially silicon rubber sockets and (PCR) sockets. High-purity nickel-based
Special plating treatment is applied to the powder to secure excellent conductive contact stability and durability
and customer-tailored particle distribution and plating composition can be provided.
It is a next-generation conductive material that minimizes quality deviation and realizes 50% reduction in the number of processes, 20% improvement in performance, and 30% reduction in unit cost compared to existing products.
Main application fields
- Semiconductor test sockets (Rubber Socket, Burn-in Socket, Probe Card), etc.
- High-precision contact material pitch for fine response
- Special parts requiring high heat resistance and high conductivity /

Product Features
- High-purity nickel-based particles (99%) ≥
- Customized plating compositions such as Au, Ag can be selected
- Classification of fine particles of 16 (0.2mm Pitch) ㎛ or less can be provided
- Excellent surface resistance uniformity and improved contact reliability
- Optimization of plating thickness, challenge, and mechanical strength possible
- Precision particle size classification through sieves of various sizes