The lead frame is a major semiconductor component that electrically connects the semiconductor chip and an external circuit (lead) and serves as a substrate (frame) that supports the chip within the semiconductor package. We have leadframe solutions optimized for automotive, mobile, and PC. The core technologies are as follows:
First, we improve the completeness of automotive semiconductor packages with high-reliability nano plating technology.
Second, we provide micro-shape processing technology suitable for thin and miniaturized electronic devices.
Finally, our lead frame has mass production technology that allows for high productivity and stable quality control.