Ferromagnetic materials deposition
Oxides deposition
Metals deposition

Special Features

Ultra-high-vacuum sputter system for R&D and small scale production(base pressure: 6 X 10-9 Torr).
Pumping system equipped with ion and turbomolecular pumps.
Predeposition process of oxides or metals in the load-lock chamber.
Automatic mask loading system.
The permanent magnetic system is installed in the main chamber.

Specifications

Wafer capacity : 4 x 3" (4 x 4")
Average throughput Up to 20,000 wafers per year
Dimension : 1,575L X 1,720H X 930W (mm3)
Power : AC 600W (13.56MHz)
Gas : Ar / O2
Pump : rotary(980l/min) & turbo(1,000l/s) & ionization(500l/s)